Circuits Assembly Online Magazine - 01005: Size Does Matter
WEBFeb 2, 2015 · The smallest component currently in use is known as an 01005. This is a passive component (resistor, capacitor) possessing extremely small weight and dimensions (FIGURE 1). The device is almost invisible to the naked eye. Its dimensions are 0.4mm in length by 0.2mm in width, with a height that varies …
IFC Considers $150M Investment in Salcomp India Expansion
WEBApr 5, 2024 · Salcomp Tech would use the funds to expand its manufacturing capacity in Chennai. The total project cost is $250 million and IFC is providing a seven-year loan up to $150 million to fund the project. Salcomp Tech is 100% owned by Salcomp Plc, a Finland-based holding company. Salcomp Plc is a wholly …
Understanding 3D AOI, What It Is, and What It Isn’t - Circuits …
WEBDec 1, 2013 · Currently, AOI systems come with different levels of 3D coverage for components and solder joints. All 3D systems still offer 2D lighting and 2D inspection. It is for the AOI programmer or the QA department to decide to what extent they’d like to deploy new technology for quality assurance. Contrary to common opinion, the polarity of ...
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WEBInspectis Offers Extended Reach BGA-XL Stand. Inspectis' BGA-XL stand allows inspection of ultra-low clearance BGAs, and optional new XM lenses provides up to 285x screen magnification. PVA Updates PathMaster X Dispensing Software. PVA released of the latest version of its PathMaster X software for its Direct Series Delta 6 and Delta 8 systems.
Sn-Bi Low-Temperature Homogeneous Solder Joint Microstructure ...
WEBJan 21, 2020 · How do LTS solders perform under thermal cycling and drop-shock testing? Several environmental, technology and reliability factors have recently combined to renew interest in the use of tin-bismuth-based solder alloys for motherboard manufacturing.
TopLine Releases Braided Solder Columns - Circuits Assembly
WEBJun 17, 2024 · TopLine's new braided solder columns are designed to serve as a drop-in replacement for solder spheres used in BGA components. Are said to be especially suited for cryogenic environments and next generation applications, and provide improved reliability and thermal properties over competing technologies. Are non-collapsible, RoHS compliant, and ...
Nordson YESTECH Investment Takes MC Assembly's ... - Circuits …
WEBElectronics Manufacturing Services Provider Invests in Upgraded 3D Inspection of Printed Circuit Board Assemblies. Melbourne, Florida (PRWEB) March 21, 2017 -- MC Assembly, a leading mid-tier electronics manufacturing services provider, recently enhanced its inspection capabilities by purchasing and installing a Nordson YESTECH FX940 ULTRA 3D Automated Optical Inspection (AOI) machine.
Hermetic Sealing Technologies Enable Reliable Welds and Protect ...
WEBNov 9, 2020 · Hermetic sealing is the encapsulation of electronic components into an airtight metal or ceramic housing using either parallel gap resistance seam welding or opposed electrode projection resistance welding. It is a key manufacturing process utilized in assembling micro-electronic packages for communication, aerospace and …
WEBThis amount was applied in the tin/lead experiment. For a no-clean, alcohol flux of 1.5 percent solids, the amount to apply on the test board is: Area board = 100 * 160 mm2 = 24.8 in2. Amount of (wet) flux per board = solid content flux * area * required amount dry flux = 100/1.5 * 24.8 * 0.0016 = 2.645 g.
Locating BGA Joint Failures - Circuits Assembly
WEBFeb 26, 2020 · This month we show examples of testing BGAs with a “dye and pry,” a simple and cost-effective way of looking at joint failure or their condition after some form of mechanical testing or abnormal assembly practice. FIGURE 1 shows a sample BGA joint after dye-and-pry testing. Eighty percent of the separated surface is covered by the red dye.